Approved presentations
1.1 - DESAB 1 (exhibitor)
Title: The Real Flying Prober: Problems & Solutions
Abstract: Scorpio has developed a technique to yet another level/dimension. All engineers that have tried to access a double sided surface mounted PCB only have probes on side can easily understand Flying Scorpios advantages. * Moving probes on both sides. * Flexible number of probes (max 24 probes!!)
| Presenter: | Manfred Philipigh, Scorpion Technologies |
|---|---|
| Contact: | Stefan Claeson DESAB Elektroniksystem AB Tel: +46 8 711 70 00 Fax: +46 8 711 70 10 Mob: +46 70 662 34 10 stefan.claeson@desab-elektronik.se www.desab-elektronik.se |
1.2 - Acoutronic 1 (Exhibitor)
Title: Electrical and Optical Instruments
Abstract: Acoustic camera – a new measurement technique. Presentation will include application examples off this new technique.
| Presenter: | Torbjörn Kloow |
|---|---|
| Contact: | Torbjörn
Kloow Acoutronic AB Box 1180 SE-181 23 Lidingö, Sweden Tel:+46-8-765 02 80 mobile:+46-70-597 02 80 toby@acoutronic.se |
1.3 - Acterna 1 (Exhibitor)
Title: Triple Play via enhanced DSL
Abstract: In order to maintain their customer base and increase revenue, telecom operators are moving beyond DSL connectivity alone, and are beginning to exploit new broadband technologies enabling the deployment of new revenue generating services. Adding video to existing voice and data services and offering all three as a bundle is now being called “Triple Play” service (Voice, Data and Video). The availability of new, enhanced ADSL technologies are an enabler for deployment of these bandwidth hungry Triple Play applications.
| Presenter: | Dag Hauge, Tekniska chef |
|---|---|
| Contact: |
Bengt Carlson Managing Director Acterna Nordic AB Box 65 SE-123 22 FARSTA Storforsplan 36, fl 10 bengt.carlson@acterna.com Phone: +46 8 449 48 01 Mobile: +46 70 593 47 28 |
1.4 - Acterna 2 (Exhibitor)
Title: Fibre Testing in the Future - Broadband distribution networks
Abstract: Discuss the technology within the area of Fibre to The ”what ever” FTTx which again has become an interesting access method.
| Presenter: | Thomas
Jolly Acterna's Division of Fiber Optics in France |
|---|---|
| Contact: |
1.5 - Agilent 1 (Exhibitor)
Title: Future of Test
Abstract: The "Future of Test" is an overview of the software, I/O, and instrumentation that will be used in the future. The presentation will show how standard PC I/O (LAN and USB) will be used to connect instruments to computers more efficiently. It will show how instrumentation in the future will take advantage of internal processors and memory to increase the overall speed of the test system. The presentation will introduce LXI (LAN eXtensions for Instruments), a modular standard to reduce the overall size of test systems. Finally, the presentation will show how the latest software tools can take advantage of LAN to check status and control instruments more easily. The "Future of Test" is a view into what promises to be an exciting future for test and measurement.
| Presenter: | Ronny Pechel |
|---|---|
| Contact: |
Britt Ljuhs Informationschef britt.ljuhs@agilent.com Agilent Technologies Sweden AB Box 52 Kronborgsgränd 23 164 94 Kista Tel: +46 8 506 486 60 Mobile: +46 70 550 20 61 |
1.6 - Agilent 2 (Exhibitor)
Title: Challenges in Analyzing and Characterization of High Speed Serial Buses
Abstract: By now you already know that interconnections within high-speed digital systems are moving rapidly from parallel, multi-drop, bidirectional buses with separate clock and data to serial, unidirectional links with the clock embedded in the data and with an emphasis on protocol. Due to the high speeds of some of these serial data links, a new set of tools and skills is needed to thrive in this new environment.
In the old world, data was typically transferred between agents via one or more parallel data lines, along with a clock signal to provide a timing reference. The data bus was often multidrop and bidirectional.
In the new world that we will be discussing in this presentation, one wire (or pair of wires, for differential signals) carries both the data and the timing information. Typically (but not always), these links are unidirectional and are not multidrop.
There may be multiple lanes of data, but each lane carries the timing information embedded in the data on that lane.
Change is both a threat and an opportunity. These new serial protocols offer you, your company, and your project an opportunity to deliver even higher performance and reliability.
| Presenter: | |
|---|---|
| Contact: |
1.7 - DELTA 1 (Exhibitor)
Title: Stop failures early using HALT!
Abstract: HALT is an abbreviation for "Highly Accelerated Life Testing" and is a relatively new method which aims too expose prototypes to extreme environmental affects and thereby finding and locating defects early in the development cycle. The method offers clear advantages testing electronics.
| Presenter: | |
|---|---|
| Contact: |
Jörgen Leijon Försäljningschef DELTA Development Technology AB Finnslätten, Elektronikgatan 47 SE-721 36 VÄSTERÅS Sweden Tel: +46 (0)21-31 44 91 GSM: +46 (0)705-15 15 64 Fax: +46 (0)21-31 44 81 E-mail: jorgen.leijon@delta-dt.se |
1.8 - National Instruments 1 (Exhibitor)
Title: Technologies for improving time-correlation in mixed signal measurements
Abstract: This presentation will discuss ways of integrating multiple measurement and generation devices, such as DMMs, oscilloscopes, digital pattern generators, logic analysers and RF instrumentation to work in a time-correlated measurement system.
| Presenter: | |
|---|---|
| Contact: |
Leif Johansson National Instruments 0709 279500 leif.johansson@ni.com |
1.9 - Orbis/Tektronix 1 (Exhibitor)
Title: Driving factors that cause Signal Integrity issues and how to solve them.
Abstract:
- How Signal integrity involves both the digital and
analogue view
-Tight correlation of digital and
analogue
data
-Multi-channel analysis using oscilloscope-generated eye
diagrams
| Presenter: | Gabor Mezofi |
|---|---|
| Contact: |
Leif Johansson National Instruments 0709 279500 leif.johansson@ni.com |
1.10 - Orbis/Tektronix 2 (Exhibitor)
Title: Ensuring BER Performance at Interfaces Using Timing Jitter Measurement Technologies
Abstract: Increasing speeds at interfaces reduce timing margins and increase bit errors. Measuring Jitter helps determine interface quality and estimate BER behaviour. This presentation covers methods to measure timing quality at interfaces using Jitter Measurement Methods.
| Presenter: | Tuomo Heikkilä, Technical Support Manager, Orbis Oy |
|---|---|
| Contact: |
Leif Johansson National Instruments 0709 279500 leif.johansson@ni.com |
1.11 - Anritsu 1 (Exhibitor)
Title: Application Testing - Integration of Protocol stack and higher layers for multimedia mobiles.
Abstract: Proving its continuous commitment to help provide 3G services, Anritsu has introduced the MD8470A Signalling Tester, designed to enable the wireless communications industry to rapidly develop and deploy new services and applications onto next generation mobile phones. The MD8470A provides a complete 'network simulator on the desk' allowing developers to test new features, services and applications on real handsets in a live environment with the convenience of a desk top test unit.
| Presenter: | Olaf Eissrig |
|---|---|
| Contact: |
Leif Johansson National Instruments 0709 279500 leif.johansson@ni.com |
1.12 - Anritsu 2 (Exhibitor)
Title: Smart signal analysing with connectivity to simulation software
Abstract: MATLAB is a well-known, powerful tool used widely by the R&D community. In this presentation it will be used for both simulation of a modulated signal source, and analysis of data gather by a receiver. This presentation will illustrate an example measurement utilizing MATLAB together with a well-suited Source/Receiver pair of instruments, used in the Wireless and Comm industry. MATLAB will be resident on the the Receiver (a Signal Analyzer).
The objective is to validate the simulation model by:
- converting the simulation output into a real baseband signal,
- sending the baseband signal to the receiver via direct coax cable,
- analyzing the received signal,
- comparing measured data to simulated data
Once the model is validated, it can be used to simulate various impairments to a transmitted signal, for comparison with devices designed to emulate impairments.
| Presenter: | |
|---|---|
| Contact: |
1.13 - Rohde & Schwartz 1 (Exhibitor)
Title: Balanced measurements with Network Analysers
Abstract: The trend towards smaller and more complex radio communication devices, and the increasing demand for better signal to noise performance, increases the usage of balanced (radio frequency) circuit design. The presenter will describe the benefits and challenges of this design and its implication on test. The presenter will further describe the principle of a Multiple Port RF Network Analyser and why this is required for characterising these devices.
| Presenter: | Mr. Thilo Bednors, Rohde & Schwarz GmbH |
|---|---|
| Contact: |
Ragnar Lindholm Sales Manager, Test & Measurement ROHDE & SCHWARZ Sverige AB Flygfältsgatan 15 SE-128 30 SKARPNÄCK SWEDEN Tel: +46 8 605 19 00 Mobile: +46 70 3164633 Fax: +46 8 60 519 80 E-post: ragnar.lindholm@rss.rohde-schwarz.com Website: http://www.rohde-schwarz.se |
1.14 - SAAB Test Systems 1 (Exhibitor)
Title: Boundary Scan in System Test
Abstract: Boundary Scan for system test using a buss in the backplane for communication between PCBs. This method can also be used during normal execution of the system whereby one PCB is the master.
| Presenter: | Mikael Löfbom |
|---|---|
| Contact: |
Hans-Erik Uleander SAAB Test Systems |
1.15 - Teradyne 1 (representerade av Exhibitor)
Title: The Impact of Low Voltage Technology on Electrical Test.
Abstract:
Today's new low voltage technology devices deliver
smaller, more powerful consumer products with longer
battery life than ever before. Yet, while these
technologies yield significant consumer benefits, they
pose substantial challenges to electronics
manufacturers. The technology roadmaps of the major
semiconductor manufacturers reveal progression toward
lower logic voltage thresholds with 90nm technologies
today and 65nm tomorrow. Smaller device sizes and lower
maximum voltage thresholds cause new technology devices
to be vulnerable to over-voltage and over-current during
powered-up testing. Because these over-voltage and
over-current conditions can occur routinely on
conventional in-circuit testers, the new low voltage
components can be immediately destroyed or damaged in
ways leading to early-life product failures in the
field.
This presentation discusses the impact of these new
technologies on electrical test.
| Presenter: | Michael J Smith |
|---|---|
| Contact: | Jürgen Sedlacek, Teleinstrument KonTest |
1.16 - Teradyne 2 (representerade av Exhibitor)
Title: Understanding AXI Acquisition Techniques and Image Quality
Abstract: This paper/presentation is a practical guide to Automatic X-Ray Inspection, as it is now becoming a major inspection technique for high reliability PCB manufacturing. It explore the market forces and technologies that are driving the use of AXI, explain the capability and limitations of the three major techniques, transmission, laminography and tomosynthesis and review the image quality produced. The capability of AXI systems to directly and indirectly render images that represent the solder joint and potential defects, such as voids, will be discussed and the possible impact of IPC 7-32.
| Presenter: | Michael J Smith |
|---|---|
| Contact: |